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By certification 
1. Base material: FR-4/H-Tg FR-4/lead-free materials/CEM-3, aluminum, Rogers, ceramics
2. Copper thickness: 1-6oz
3. Board thickness: 0.2-8.5mm
4. Minimum hole size: 0.2mm
5. Minimum line width: 3 mil
6. Minimum line spacing: 3 mil
7. Surface finishing: HASL, ENIG, immersion silver, immersion tin
8. Outline: routing, V-groove, beveling punch
9. Solder mask colors: green, red, blue, black, white
10. Silkscreen colors: red, yellow, black, white
11. Hole position deviation: ±0.05mm (±2mil)
12. PTH diameter: ±0.076mm (±3mil)
13. NPTH diameter.: ±0.05mm (±2mil)
14. Minimum S/M pitch: 0.1mm (4mil)
15. Outline tolerance: ±0.15mm
16. Heavy copper: 4oz - 8oz
17. Peelable mask: top, bottom, double sided
2. Copper thickness: 1-6oz
3. Board thickness: 0.2-8.5mm
4. Minimum hole size: 0.2mm
5. Minimum line width: 3 mil
6. Minimum line spacing: 3 mil
7. Surface finishing: HASL, ENIG, immersion silver, immersion tin
8. Outline: routing, V-groove, beveling punch
9. Solder mask colors: green, red, blue, black, white
10. Silkscreen colors: red, yellow, black, white
11. Hole position deviation: ±0.05mm (±2mil)
12. PTH diameter: ±0.076mm (±3mil)
13. NPTH diameter.: ±0.05mm (±2mil)
14. Minimum S/M pitch: 0.1mm (4mil)
15. Outline tolerance: ±0.15mm
16. Heavy copper: 4oz - 8oz
17. Peelable mask: top, bottom, double sided